| 000 | 02906cam a2200565 i 4500 | ||
|---|---|---|---|
| 001 | 9781003029328 | ||
| 003 | FlBoTFG | ||
| 005 | 20220724194541.0 | ||
| 006 | m o d | ||
| 007 | cr cnu---unuuu | ||
| 008 | 200103t20202020flua ob 001 0 eng | ||
| 040 |
_aOCoLC-P _beng _erda _cOCoLC-P |
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| 020 |
_a9781003029328 _qelectronic book |
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| 020 |
_a1003029329 _qelectronic book |
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| 020 |
_a9781000047387 _qelectronic book |
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| 020 |
_a1000047385 _qelectronic book |
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_z9780367465315 _qhardcover |
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| 020 |
_a9781000047462 _q(electronic bk. : EPUB) |
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| 020 |
_a1000047466 _q(electronic bk. : EPUB) |
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| 020 |
_a9781000047424 _q(electronic bk. : Mobipocket) |
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| 020 |
_a1000047423 _q(electronic bk. : Mobipocket) |
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| 020 | _z0367465310 | ||
| 035 |
_a(OCoLC)1151520737 _z(OCoLC)1154860026 |
||
| 035 | _a(OCoLC-P)1151520737 | ||
| 050 | 4 |
_aTK7870.25 _b.E43 2020eb |
|
| 072 | 7 |
_aTEC _x005050 _2bisacsh |
|
| 072 | 7 |
_aTEC _x007000 _2bisacsh |
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| 072 | 7 |
_aTEC _x008000 _2bisacsh |
|
| 072 | 7 |
_aTJF _2bicssc |
|
| 082 | 0 | 0 |
_a621.381/044 _223 |
| 100 | 1 |
_aEllison, Gordon N., _eauthor. |
|
| 245 | 1 | 0 |
_aThermal computations for electronics : _bconductive, radiative, and convective air cooling / _cGordon N. Ellison. |
| 250 | _aSecond edition. | ||
| 264 | 1 |
_aBoca Raton, FL : _bCRC Press, Taylor & Francis Group, _c2020. |
|
| 264 | 4 | _c©2020 | |
| 300 |
_a1 online resource (xxi, 382 pages) : _billustrations |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 520 |
_a"The flavor and organization of the first edition has been retained whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer. The first twenty percent of the book is devoted to the prediction of airflow and well-mixed air temperatures in systems, circuit board channels, and heat sinks, followed by convective (PCB-mounted components included), radiative, and conductive heat transfer and the resultant temperatures in electronic equipment. Detailed application examples illustrate a variety of problems"-- _cProvided by publisher. |
||
| 588 | _aOCLC-licensed vendor bibliographic record. | ||
| 650 | 0 |
_aElectronic apparatus and appliances _xThermal properties _xMathematical models. |
|
| 650 | 0 |
_aElectronic apparatus and appliances _xCooling _xMathematics. |
|
| 650 | 7 |
_aTECHNOLOGY / Construction / Heating, Ventilation & Air Conditioning _2bisacsh |
|
| 650 | 7 |
_aTECHNOLOGY / Electricity _2bisacsh |
|
| 650 | 7 |
_aTECHNOLOGY / Electronics / General _2bisacsh |
|
| 856 | 4 | 0 |
_3Read Online _uhttps://www.taylorfrancis.com/books/9781003029328 |
| 856 | 4 | 2 |
_3OCLC metadata license agreement _uhttp://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf |
| 942 |
_2lcc _cEBK |
||
| 999 |
_c18773 _d18773 |
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